JIS Z 3198-3: 2003 Test methods for lead-free solders - Part 3: Methods for spread test

Japanese Industrial Standard (JIS). Date of Establishment: 2003-06-
20. First English edition published in 2003-12. 8 p. This Standard specifies the method of spread test of lead-free solder to be used principally for wiring connection, parts connection and the like of electrical machinery and apparatus, electronic apparatus, communication equipment and the like.