JIS Z 3198-4: 2003 Test methods for lead-free solders - Part 4: Methods for solderability test by a wetting balance method and a contact angle method

Japanese Industrial Standard (JIS). Date of Establishment: 2003-06-
20. First English edition published in 2003-12. 14 p. This Standard specifies the methods for solderability test of a wetting balance method and a contact angle method of lead-free solder to be used principally for wiring connection, parts connection and the like of electrical machinery and apparatus, electronic apparatus, communication equipment and the like.