JIS Z 3198-6: 2003 Test methods for lead-free solders - Part 6: Methods for 45º pull test of solder joints on QFP lead

Japanese Industrial Standard (JIS). Date of Establishment: 2003-06-
20. First English edition published in 2003-12. 7 p. This Standard specifies methods for 45 pull test of solder joints on QFP lead to be used principally for wiring connection, components connection and the like of electrical machinery and apparatus, electronic apparatus, communication equipment and the like.