JIS Z 3198-7: 2003 Test methods for lead-free solders - Part 7: Methods for shear strength of solder joints on chip components

Japanese Industrial Standard (JIS). Date of Establishment: 2003-06-
20. First English edition published in 2003-12. 7 p. This Standard specifies test methods for shear strength of solder joints on chip components by using lead-free solder to be used principally for wiring connection of electrical machining and apparatus, electronic apparatus, communication equipment or the like, wiring connection of components and the like.