Sun Yangyang. Study on the nanocomposite underfill for flip-chip application

A Thesis Presented to The Academic Faculty . In Partial Fulfillment of the Requirements for the Degree Doctor of Philosophy in the School of Chemistry and Biochemistry
Georgia Institute of Technology, December, 2006. – 216 p.Nanosilica synthesis and modification
Material properties characterization of the nanocomposite underfill after curing
Influence of interphase and moisture on the dielectric spectroscopy of epoxy/silica composites
The hardener effects to colloidal silica dispersion
Photo-polymerization of epoxy nanocomposite for wafer level application
Conclusions and suggested work
Appendix a author’s awards, patents, and publicaitons