Gilleo K. MEMS / MOEM Packaging: Concepts, Designs, Materials and Processes

McGraw-Hill, 2005, 220 pages, ISBN: 0071455566While MEMS technology has progressed rapidly, commercialization of MEMS has been hindered by packaging technology barriers and costs. One of the key issues in the industrialization of MEMS, MOEM and ultimately Nanoelectrical devices is the development of appropriate packaging solutions for the protection, assembly, and long term reliable operation. This book rigorously examines the properties of the materials used in MEMS and MOEN assembly then evaluates them in terms of their routing, electrical performance, thermal management and reliability. With this as a starting point, the book moves on to discuss advanced packaging methods such as: molded thermoplastic packages for MEMS, wafer-assembled RFID, and wafer-level stacked packaging.Engineering Fundamentals of MEMS and MOEMS Electronic Packaging
Principles, Materials, and Fabrication of MEMS and MOEMS Devices
MEMS and MOEMS Packaging Challenges and Strategies
MEMS Packaging Processes
MEMS Packaging Materials
From MEMS and MOEMS to Nanotechnology